GPM-5 HEAT SINK COMPOUND WITH METALLIC PARTICLES - 5 CC SYRINGE

 

 

GPM-5 Thermal Joint Compound

Description

GPM-5, a thermal joint compound with metallic particles, efficiently transfers heat energy from the microprocessor or other components to their heatsink. When both surfaces come into contact, air pockets are trapped due to the micro-roughness present in each material, causing the heat flow to concentrate solely at the contact points. GPM-5 compound enables a highly efficient energy transfer by filling the imperfections on the contact surfaces. Consequently, the overall thermal resistance is significantly reduced, allowing for improved microprocessor performance and lower operating temperatures.

 

 

 

With over 50 years of experience, we are distributors of welding and polishing supplies. Located at 338 General Enrique Mosconi Avenue, we provide specialized technical assistance in welding, abrasives, and polishing.

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